Power Module Reliability
Solder-free and without base plate The reliability of a power module is of vital importance to the user, who expects his system to work unimpaired throughout its entire service life. The...
View ArticlePressing Home the Advantages
Press-Fit pin for solder-less assembly Solder pins have been the interface of choice for power modules for many years. The new press-fit pin developed by Vincotech takes the assembly properties...
View ArticleCoordinated Circuit Protection for High-Speed USB Applications
USB 3.0 applications need circuit protection on the jack USB (Universal Serial Bus) has become the most popular and pervasive connectivity technology for portable electronics. As the adoption of...
View ArticleHigh Voltage BiPolar Semiconductor Technologies
A comprehensive introduction to the recent developments in the field of BiPolar high power semiconductors The main development trend of power devices has always been focused on increasing the...
View ArticleAdaptive BEM and FEM Meshing Increases Confidence in Electromagnetic...
The presence of both kinds of solvers also provides an extra level of confidence Chances are that if you’ve done simulation using Finite Element Method (FEM) or Boundary Element Method (BEM)...
View ArticleIPOSIM Web-based Design Support Tool for IGBT Applications
Simulation based Loss and Thermal Evaluation for Applications Using Infineon Power Modules and Disk Devices There is no simple criterion or rule of thumb to properly select suitable semiconductor...
View ArticleNovel Low Leakage Current and Low Forward Voltage Drop Triangular Diode
Protecting solar cells from reverse avalanche In solar panel applications the solar cells during periods of shadow can be permanently damaged due to reverse biasing of the cell into avalanche...
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